Biography
I'm a Ph.D. student at the Department of Computer Science and Engineering,
The Chinese University of Hong Kong (CUHK),
under the supervision of Prof. Bei Yu since Fall 2026.
Previously, I obtained my B.S. and Master degree in Software Engineering at Beijing University of Technology.
My research interest includes deep learning for VLSI physical design and assessment.
Research Interests
- Image, graph, point cloud, and multi-modal learning for EDA
- Timing, Power, IR-drop, and thermal shift left assessment
- Power, IR-drop and thermal-aware 3DIC design
Publications
- [C6] Mingjun Wang, Yihan Wen, Yuntao Lu, Fengrui Liu, Yuxiang Zhao, Boyu Han, Jianan Mu, Yibo Lin, Runsheng Wang, Bei Yu, et al., “CircuitNet 3.0: A Multi-Modal Dataset with Task-Oriented Augmentation for AI-Driven Circuit Design”, The Fourteenth International Conference on Learning Representations, 2026.
- [C5] Mingjun Wang, Yihan Wen, Bin Sun, Jianan Mu, Juan Li, Xiaoyi Wang, Jing Justin Ye, Bei Yu, Huawei Li, Bridging layout and RTL: Knowledge distillation based timing prediction”, Forty-second International Conference on Machine Learning (ICML), 2025.
- [C4] Mingjun Wang, Hui Wang, Jianan Mu, Xinyu Zhang, Bin Sun, Yihan Wen, Zizhen Liu, Feng Gu, Jun Gao, Shengwen Liang, et al., “Epics: Efficient parallel pattern fault simulation for sequential circuits via strongly connected components”, 2025 62nd ACM/IEEE Design Automation Conference (DAC), pages 1-7, IEEE, 2025.
- [C3] Mingjun Wang, Bin Sun, Jianan Mu, Feng Gu, Boyu Han, Tianmeng Yang, Xinyu Zhang, Silin Liu, Yihan Wen, Hui Wang, et al., “MOSS: Multi-Modal Representation Learning on Sequential Circuits”, 2025 62nd ACM/IEEE Design Automation Conference (DAC), pages 1-7, IEEE, 2025.
[C2] Yihan Wen, Juan Li, Bei Yu, Xiaoyi Wang, “Peak Power and Dynamic IR-drop Assessment via Waveform Augmenting”, Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pages 1-9, 2024.
- [C1] Yihan Wen, Juan Li, Xiaoyi Wang, “Risk Propagation Based Vector Profiling for High Coverage Dynamic IR-Drop Analysis”, 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD), pages 1-8, IEEE, 2023.